Worldwide Automotive Central Gateway Module Industry to 2024 - Key Drivers, Challenges and Trends - ResearchAndMarkets.com
The "Global Automotive Central Gateway Module Market 2020-2024" report has been added to ResearchAndMarkets.com's offering.
The automotive central gateway module market is poised to grow by $ 1.29 billion during 2020-2024 progressing at a CAGR of 7% during the forecast period.
This report on the automotive central gateway module market provides a holistic analysis, market size and forecast, trends, growth drivers, and challenges, as well as vendor analysis covering around 25 vendors.
The report offers an up-to-date analysis regarding the current global market scenario, latest trends and drivers, and the overall market environment. The market is driven by the increasing government support to promote EVs, growing importance of crash tests and NCAP ratings, and importance of automotive network security driving CGM adoption.
This study identifies the higher emphasis on traffic management to demand secure external communication as one of the prime reasons driving the automotive central gateway module market growth during the next few years. Also, adoption of high bandwidth automotive networks and development of integrated cybersecurity solution will lead to sizable demand in the market.
This report presents a detailed picture of the market by the way of study, synthesis, and summation of data from multiple sources by an analysis of key parameters.
Companies Mentioned
Continental AG
DENSO Corp.
FEV Group GmbH
Hitachi Ltd.
Infineon Technologies AG
Lear Corp.
Marelli Holdings Co. Ltd.
NXP Semiconductors NV
Renesas Electronics Corp.
Robert Bosch GmbH
The automotive central gateway module market covers the following areas:
Automotive central gateway module market sizing
Automotive central gateway module market forecast
Automotive central gateway module market industry analysis
The study was conducted using an objective combination of primary and secondary information including inputs from key participants in the industry. The report contains a comprehensive market and vendor landscape in addition to an analysis of the key vendors.
This report presents a detailed picture of the market by the way of study, synthesis, and summation of data from multiple sources by an analysis of key parameters such as profit, pricing, competition, and promotions. It presents various market facets by identifying the key industry influences. The data presented is comprehensive, reliable, and a result of extensive research - both primary and secondary.
This market research report provides a complete competitive landscape and an in-depth vendor selection methodology and analysis using qualitative and quantitative research to forecast an accurate market growth.
Key Topics Covered:
1. Executive Summary
Market Overview
2. Market Landscape
Market ecosystem
Value chain analysis
3. Market Sizing
Market definition
Market segment analysis
Market size 2019
Market outlook: Forecast for 2019-2024
4. Five Forces Analysis
Five forces summary
Bargaining power of buyers
Bargaining power of suppliers
Threat of new entrants
Threat of substitutes
Threat of rivalry
Market condition
5. Market Segmentation by Application
Market segments
Comparison by Application
Passenger cars - Market size and forecast 2019-2024
Commercial vehicles - Market size and forecast 2019-2024
Market opportunity by Application
6. Customer landscape
Overview
7. Geographic Landscape
Geographic segmentation
Geographic comparison
APAC - Market size and forecast 2019-2024
North America - Market size and forecast 2019-2024
Europe - Market size and forecast 2019-2024
South America - Market size and forecast 2019-2024
MEA - Market size and forecast 2019-2024
Key leading countries
Market opportunity by geography
Market drivers
Market challenges
Market trends
8. Vendor Landscape
Overview
Vendor landscape
Landscape disruption
9. Vendor Analysis
Vendors covered
Market positioning of vendors
Continental AG
DENSO Corp.
FEV Group GmbH
Hitachi Ltd.
Infineon Technologies AG
Lear Corp.
Marelli Holdings Co. Ltd.
NXP Semiconductors NV
Renesas Electronics Corp.
Robert Bosch GmbH
10. Appendix
Scope of the report
Currency conversion rates for US$
Research methodology
List of abbreviations
For more information about this report visit https://www.researchandmarkets.com/r/n2g2wq
View source version on businesswire.com: https://www.businesswire.com/news/home/20201014005504/en/
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